This website stores cookies on your computer. 4700 - 600ºF General Purpose Epoxy. It is essential to mention that it is a misconception. Arctic Alumina Adhesive uses a layered composite of aluminum oxide and boron nitride. Lids can be ceramic, glass, aluminum or kovar. Effects of Relative Humidity and Temperature on Room Temperature Curing ECAs, Insights on How to Work Best with Epoxies from EPO-TEK® Quality Control Department, Effective handling and mixing of EPO-TEK BI packs, Medical Device Epoxy - Considerations in Selection Criteria, Biocompatibility Aspects and Application Performance Requirements. p.p1 {margin: 0.0px 0.0px 0.0px 0.0px; font: 15.0px 'Helvetica Neue'; color: #4b4b4b}. Cure / Vulcanizing, Two Component System, Dielectric Constant (Relative Permittivity): 3.11, Cure Type / Technology: Thermosetting / Crosslinking, Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Features: Encapsulating / Potting, Flame Retardant (e.g. EPO-TEK® H70E-4 Advantages, Description: 4525 -500ºF Electrical Resist Gen. Purpose. Use up to 650°F. Available in many different viscosity ranges – contact Technical Services at for best recommendation Can be used as non conductive, Description: Polycast offers conductive adhesives, epoxies for electronics, epoxies for encapsulation, epoxies for potting, gel epoxies, electrically conductive coatings, general-purpose epoxy, thermally conductive epoxy and more. Good to 260°C(500°F) OMEGATHERM™ 201Silicone Paste: Extremely High Thermal Conductivity. It is designed to provide strong, resilient bonds even in cryogenic conditions. The DuPont fill has a larger particulate size and a higher finished co-efficient of thermal expansion (CTE), as well as a longstanding reputation for being a highly effective conductive epoxy fill. Description: EPO-TEK® H70E-4 is a thermally conductive, electrically insulating epoxy adhesive for semiconductor, micro-electronic and opto-electronic packaging. Non-Conductive Adhesive Die Attach Epoxy. Industrial Coatings. Description: Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. NON-SAG 5 MINUTE BONDATHERM EPOX, Description: Non Conductive Adhesives Non conductive adhesives can withstand high thermal loads and can potentially provide high shock and peel resistance. Transport properties were measured at room temperature 50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. The While not much higher than an unfilled epoxy, it can provide adequate cooling in many applications. Panacol Elecolit® 414 1-Part Silver Filled, Conductive Compounds - It may be used for heat-sinking semiconductor, hybrids, or electronic circuits. Meridian Adhesives Group                                   Description: Electrically, Epoxy Adhesives - This key property can be increased by adding metallic or ceramic fillers to the adhesive formulation. of Thermal Expansion (CTE): 26.67 to 66.11 µin/in-F, Coeff. Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks.It can be available as a paste (similar to thermal paste) or as a double-sided tape.. Formulated in multiple mediums, Henkel’s thermally conductive silicone adhesives and thermally conductive epoxy adhesives deliver on two fronts: facilitation of thermal management objectives and the elimination of space-restrictive mechanical fasteners. Cure / Vulcanizing, Thermosetting / Crosslinking. Its adhesive characteristics appear in the 40-120°C range. Below are some important questions to take into consideration... By Mavyn HolmanR&D ManagerEpoxy Technology, Inc.Fall has arrived in New England and winter will be here before we know it. One Component Thermally, Epoxy Adhesives - LOCTITE ABLESTIK 872-7TN1, Epoxy, Non-conductive adhesive LOCTITE® ABLESTIK 872-7TN1 is ideal for electronic applications requiring stress relief. Underfills are used most often in three distinct applications: • Capillary Underfills •, pacemakers to fail and watches to stop ticking. 4461 - 500ºF Low Viscosity Epoxy. Unfortunately, that means cold temperatures, snow and more importantly for our adhesives - low humidity. Thermally Conductive Adhesives are often used to bond heat sinks or encapsulate sensors. Non-Adhesive. Copyright ® 2015 Epoxy Technology, Inc. All Rights Reserved. temperature range, a thermally. ABLESTIK 45 also provides high shock and peel resistance. The worlds' most important companies in the electronics, medical device, semiconductor and fiber optics industries rely on Epoxy Technology's products for … The sides of the bimorph are now coated with a thin layer of clear, non conductive epoxy . up to 280ºC. Veuillez contacter votre bureau local pour obtenir une assistance commerciale (voir contact sur LOCTITE ABLESTIK CE 3513 (Known as Hysol ECCOBOND CE3513) -- 8799474155521, Thermal Compounds and Thermal Interface Materials, Learn More about Thermal Compounds and Thermal Interface Materials, Learn More about Silicone Adhesives and Sealants. Adhesives. In this case the Peters product has been available for a longer time but in recent years the San-Ei product has taken the lead due to a better CTE match with standard PCB laminates. It offers controlled flexibility, non-conductive properties, and is easy to use. Techsil® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. document.getElementById('cloak10575').innerHTML += '' + addy10575+'<\/a>'; The TC-2810 epoxy features good thermal conductivity (1.0 W/mK to 1.4 W/mK) and low Cl ion content and outgassing. The chart belo… It offers low coefficient of thermal expansion, low stress, versatility, Description: Arctic Silver is a fantastic thermally conductive epoxy mainly due in part to the fact that it is made with 99.8% pure micronized silver. of Thermal Expansion (CTE): 21.11 to 75.56 µin/in-F, Dielectric Constant (Relative Permittivity): 5.3, Cure Type / Technology: Two Component System, Coeff. Formulated to draw heat away from sensitive electronic components, these potting compounds have higher thermal conductivity than standard potting compounds. The edges of the support plate are of Thermal Expansion (CTE): 14 µin/in-F, Dielectric Constant (Relative Permittivity): 5.9, Dielectric Constant (Relative Permittivity): Over 4.5, Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Description: Thermally Conductive Adhesives. If you are seeing this message your browser has JavaScript disabled. This system offers excellent heat transfer, low shrinkage, and outstanding. Another benefit is the epoxy can also be thermally conductive, meaning it can also cool the component. EPO-TEK® H77, Description: Medical grade epoxy is used in a variety of applications and medical device assembly. of Thermal Expansion (CTE): 18.33 to 72.22 µin/in-F, Cure Type / Technology: Single Component System, Coeff. 4460 - 600ºF Low Viscosity Epoxy. This email address is being protected from spambots. Description: However, when impregnated with different metallic flakes, electrically conductive epoxy is made. where the adhesive would. For additional product selection assistance. Non-Conductive Via Fill – Overview. It does not contain solvents and is stable under high vacuum. It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.. Please refer to the TDS for alternate cure schedules. Electrically Conductive Epoxies. LOCTITE ABLESTIK 8-2, Epoxy, Non-conductive Die Attach Adhesive LOCTITE® ABLESTIK 8-2 non-conductive die attach adhesive is designed for MEMs package applications. Meets NASA low outgassing specifications. Shore D hardnes >75. on the films transferred from the conducting substrate to the non conducting epoxy as described under experimental. //